Oct 1 2008
PANalytical (Almelo, The Netherlands) will launch new products and showcase its full range of innovative X-ray metrology solutions on booth #144 at Semicon Europa 2008, October 7-9, Stuttgart Trade Fair Centre, Germany.
This premier event will see a PANalytical focus on tools for process control, pilot manufacture and R&D of semiconductor, MEMS, solar cell and data storage type of applications. PANalytical is unique in developing ‘backbone’ analytical tools – an approach that provides data that is relevant and transferable as a material or product moves from R&D through pilot production to volume lines.
A highlight on the PANalytical booth will be the European launch of an updated version of the company’s SuperQ 4.0 Thin Film package, for use on the PW2830 wavelength dispersive XRF system and the Semyos micro-XRF wafer analyzer. This proven software for thickness, composition and uniformity analysis of thin films now includes enhanced Fundamental Parameter Software (FP Multi). Best in class performance across a range of applications is assured, with the analysis of up to 16 complex layers and the facility to measure and track wafers through deposition steps to stack completion.
PANalytical’s X-ray diffraction (XRD) range will be represented by the X’Pert PRO MRD and MRD XL, valuable tools for III-V, and other, types of solar cells. The X’Pert PRO family is the most flexible XRD solution available for thin film epitaxial and polycrystalline requirements and is designed for the rapid analysis of a wide range of structural properties, including film thickness, lattice mismatch, surface and interface roughness, defect density, domain size and much more. Unique PreFIX modules allow reconfiguration without the need for re- alignment.
For semiconductor manufacturers who need tight processes monitoring throughout the entire production chain, PANalytical’s PW2830 XRF Wafer Analyzer complies with all current 300 mm standards. Semiconductor and data storage layer composition and thickness; as well as dopant levels and surface uniformity can be determined on wafers up to 300 mm in a fully automated environment.
The latest solution for on-product X-ray analysis of thin films, Semyos is a high-performance, energy dispersive XRF metrology tool with a measuring spot of less than 23 µm FWHM (Full Width Half Maximum). This enables direct measurement on production wafers of up to 300 mm. The system covers a wide application range, including: characterization of films containing elements from Al onwards in metrology areas in the scribeline, accept/reject assessment of complex stacks, control of the metallization processes, analysis of barrier films, and characterization of read/write heads and magnetic media thin films.