Feb 5 2008
Yingli Green Energy Holding Company Limited, one of the world's leading vertically integrated photovoltaic (PV) product manufacturers, today announced guidance for its 2008 PV module shipments and the achievement of a significant operating milestone.
Based on the Company's current forecast on anticipated manufacturing capacity, operating efficiency and customer demand, the Company currently expects its PV module shipment target for the full year of 2008 to be in the estimated range of approximately 255MW and 265MW.
The Company also announced that it has successfully reduced the thickness of its wafers from 200 microns in 2007 to 180 microns at the beginning of February 2008. The Company expects this reduction in wafer thickness to benefit Yingli Green Energy by reducing its polysilicon usage per watt, increasing wafer output per ingot and contributing to a reduction in cost of goods sold.
Based on its current polysilicon supply contracts and the potential higher yield in its production process from reduced wafer thickness, the Company believes it has now secured more than 70% of its expected polysilicon needs for 2008, of which the majority is virgin polysilicon.
"We are pleased to announce the reduction in our wafer thickness and that over 70% of our estimated polysilicon needs for 2008 has been contracted," commented Mr. Liansheng Miao, Chairman and Chief Executive Officer of Yingli Green Energy. "Our continued efforts to improve operating efficiencies and reduce wafer thickness have demonstrated the success of our R&D and other strategic initiatives and we believe these achievements will help us to be more competitive in 2008."